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| 1.6x0.8mm SMD CHIP LED LAMP KP-1608SYC SUPER BRIGHT YELLOW Features !1.6mmx0.8mm !LOW !WIDE Description SMT LED, 1.1mm THICKNESS. The Super Bright Yellow source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. POWER CONSUMPTION. VIEWING ANGLE. FOR BACKLIGHT AND INDICATOR. COLORS AND LENS TYPES AVAILABLE. !IDEAL !VARIOUS !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: KDA0024 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/04/2001 DRAWN: S. H. CHEN PAGE: 1 OF4 Selection Guide Par t No . Di c e L en s Ty p e Iv (mc d ) @ 20 mA Min . KP-1608SYC SUPER BRIGHT YELLOW ( InGaAlP ) WATER CLEAR 40 Ty p . 80 View in g An g l e 21/2 120 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l peak D 1/2 C VF IR Par ameter Peak Wavelength Dominate Wavelength Spectral Line Halfwidth Capacitance Forward Voltage Reverse Current Dev ic e Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Ty p . 590 588 28 25 2.0 2.5 10 Max . Un i t s nm nm nm pF V uA Tes t Co n d itio n s IF=20mA IF=20mA IF=20mA VF=0V;f=1MHz IF=20mA VR = 5V Absolute Maximum Ratings at T)=25C Par ameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating Temperature Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Su p er B r ig h t Yello w 125 30 175 5 -40C To +85C -40C To +85C Un i t s mW mA mA V SPEC NO: KDA0024 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/04/2001 DRAWN: S. H. CHEN PAGE: 2 OF4 Super Bright Yellow KP-1608SYC SPEC NO: KDA0024 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/04/2001 DRAWN: S. H. CHEN PAGE: 3 OF4 KP-1608SYC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: KDA0024 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/04/2001 DRAWN: S. H. CHEN PAGE: 4 OF4 |
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